| سال | هفته | ID | Title | ApplNo | IPC | Applicant | Subgroup | زیر گروه | رشته | شرح | Description |
|---|
2025 | 49 | WO/2025/217567 | ELECTRICAL AND OPTICAL INTERCONNECT LINKS COMBINED IN A HYBRID INTERPOSER | US2025/024346 | H01L 25/16 | ACORN SEMI, LLC | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/230785 | COOLING SYSTEM FOR POWER ELECTRONICS | US2025/025920 | H01L 23/427 | CARRIER CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/245724 | DRIVING BACKPLANE AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL, AND DISPLAY DEVICE | CN2024/095977 | H01L 27/12 | SOUTHERN UNIVERSITY OF SCIENCE & TECHNOLOGY | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/245861 | FULL-COLOR NANO-LED ARRAY | CN2024/096754 | H01L 33/38 | INSTITUTE OF SEMICONDUCTORS, CHINESE ACADEMY OF SCIENCES | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/246069 | TEMPERATURE EQUALIZING HEAT DISSIPATION APPARATUS AND MANUFACTURING METHOD AND DESIGN METHOD THEREFOR, STORAGE MEDIUM, AND ELECTRONIC DEVICE | CN2024/116788 | H01L 23/367 | CRRC ZHUZHOU ELECTRIC LOCOMOTIVE RESEARCH INSTITUTE CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/246150 | PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE, AND ELECTRONIC DEVICE | CN2024/126273 | H01L 23/498 | CXMT CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/246154 | SEMICONDUCTOR PROCESSING DEVICE | CN2024/126962 | H01L 21/67 | JIANGSU LEUVEN INSTRUMENTS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/246303 | CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE | CN2024/140412 | H01L 23/31 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/246643 | BACKLIGHT LAMP PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | CN2025/087172 | H01L 25/075 | BOE TECHNOLOGY GROUP CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/246683 | ELECTRONIC COMPONENT TRANSFER DEVICE | CN2025/088334 | H01L 21/00 | BOE TECHNOLOGY GROUP CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/246688 | DISPLAY PANEL AND DISPLAY DEVICE | CN2025/088734 | H01L 23/552 | WUHAN TIANMA MICROELECTRONICS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/246756 | PACKAGING STRUCTURE CLEANING METHOD AND APPARATUS | CN2025/091421 | H01L 21/67 | ACM RESEARCH (SHANGHAI) , INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/246758 | CLEANING METHOD AND CLEANING DEVICE FOR PACKAGED STRUCTURE | CN2025/091435 | H01L 21/67 | ACM RESEARCH (SHANGHAI) , INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/246759 | PRE-WETTING METHOD AND DEVICE FOR WAFER | CN2025/091445 | H01L 21/768 | ACM RESEARCH (SHANGHAI) , INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/247014 | POWER MODULE AND SEMICONDUCTOR DEVICE | CN2025/095962 | H01L 23/498 | BYD COMPANY LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/247047 | MOS DEVICE AND OVERHEATING PREVENTION METHOD THEREFOR, CONTROLLER, CONTROL SYSTEM, AND VEHICLE | CN2025/096319 | H01L 23/367 | BYD COMPANY LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/247095 | METHOD FOR FORMING TRENCH, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND PROCESS APPARATUS | CN2025/096773 | H01L 21/768 | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/247497 | POWER MODULE HAVING IMPROVED SWITCHING PERFORMANCE AND METHOD FOR IMPROVING SWITCHING PERFORMANCE OF A POWER MODULE | EP2024/065008 | H01L 25/07 | HITACHI ENERGY LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/247507 | APPARATUS FOR TRANSFERRING A SEMICONDUCTOR DIE FROM AN ARRANGEMENT OF SEMICONDUCTOR DIES TO A TARGET | EP2024/065112 | H01L 21/67 | NEXPERIA B.V. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/247508 | DIE BONDING APPARATUS AND METHOD UTILIZING SUCH APPARATUS | EP2024/065114 | H01L 23/00 | NEXPERIA B.V. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/247645 | POWER SEMICONDUCTOR ARRANGEMENT COMPRISING A POWER SEMICONDUCTOR ELEMENT AND A SUBSTRATE | EP2025/063252 | H01L 23/367 | SIEMENS AKTIENGESELLSCHAFT | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/247764 | SINGLE-SWITCH POWER MODULE | EP2025/064253 | H01L 23/495 | ROBERT BOSCH GMBH | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/247863 | OPTIMISED POWER UTILISATION OF SEMICONDUCTOR DEVICES IN POWER MODULES AND POWER MODULE BRIDGES | EP2025/064574 | H01L 25/07 | ROBERT BOSCH GMBH | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248202 | PRODUCTION OF A POWER MODULE | FR2025/050469 | H01L 23/15 | SAFRAN ELECTRICAL & POWER | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248355 | MULTICHIP SEMICONDUCTOR BUILD WITH FLEXIBLE POWER AND SIGNAL DISTRIBUTION INTERCONNECTIONS | IB2025/054769 | H01L 23/48 | INTERNATIONAL BUSINESS MACHINES CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248513 | COATING DIELECTRIC SURFACES WITH PATTERNED METAL LAYER | IL2025/050396 | H01L 21/302 | ISRAEL AEROSPACE INDUSTRIES LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248572 | SUBSTRATE STORAGE CONTAINER | JP2024/019322 | H01L 21/673 | MIRAIAL CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248576 | DEFECT INSPECTION DEVICE, AND DEFECT INSPECTION METHOD | JP2024/019333 | H01L 21/66 | HITACHI HIGH-TECH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248586 | SUBSTRATE PROCESSING DEVICE, SUBSTRATE PEELING METHOD, PEELING DEVICE, AND PEELING METHOD | JP2024/019393 | H01L 21/683 | MITSUBISHI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248600 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND PRINTED WIRING BOARD | JP2024/019430 | H01L 23/12 | RESONAC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248678 | GaN EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SAME | JP2024/019759 | H01L 21/205 | MITSUBISHI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248691 | QUANTUM DEVICE | JP2024/019826 | H01L 29/06 | HITACHI, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248692 | QUANTUM DEVICE AND QUANTUM INFORMATION PROCESSING DEVICE | JP2024/019827 | H01L 29/06 | HITACHI, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248712 | SWITCHING ELEMENT | JP2024/019879 | H01L 29/78 | DENSO CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248744 | EMBEDDING METHOD AND FILM FORMING DEVICE | JP2024/019986 | H01L 21/3065 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248754 | QUANTUM BIT CONTROL DEVICE, QUANTUM COMPUTER SYSTEM, AND QUANTUM BIT CONTROL METHOD | JP2024/020024 | H01L 29/06 | HITACHI, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248784 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE | JP2024/020106 | H01L 33/52 | RESONAC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248816 | MEASURING DEVICE, RESIN MOLDING DEVICE, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE | JP2024/042295 | H01L 23/28 | TOWA CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248832 | CERAMIC SUSCEPTOR | JP2024/046448 | H01L 21/683 | NGK INSULATORS, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248844 | MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS | JP2025/001940 | H01L 21/683 | NGK INSULATORS, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248846 | INSULATING CIRCUIT BOARD, METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING SAME | JP2025/002074 | H01L 23/12 | DOWA METALTECH CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248907 | HYBRID JOINING METHOD | JP2025/009229 | H01L 21/02 | JX ADVANCED METALS CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248914 | MOUNTING DEVICE | JP2025/010078 | H01L 21/60 | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248923 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | JP2025/010639 | H01L 21/304 | SCREEN HOLDINGS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248934 | CARRIER SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | JP2025/011524 | H01L 23/12 | MITSUBISHI MATERIALS CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248937 | HEAT EXCHANGE SUBSTRATE AND SEMICONDUCTOR DEVICE | JP2025/011959 | H01L 23/36 | DENSO CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248954 | PACKAGE AND METHOD FOR MANUFACTURING PACKAGE | JP2025/013519 | H01L 23/02 | SONY SEMICONDUCTOR SOLUTIONS CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248960 | SIC COMPOSITE SUBSTRATE AND MANUFACTURING METHOD THEREFOR | JP2025/013745 | H01L 21/20 | ROHM CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248962 | SUBSTRATE PROCESSING DEVICE | JP2025/013771 | H01L 21/027 | SCREEN HOLDINGS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248965 | MEMBER FOR SEMICONDUCTOR MANUFACTURING DEVICE | JP2025/013824 | H01L 21/683 | NGK INSULATORS, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248983 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | JP2025/014152 | H01L 25/04 | AOI ELECTRONICS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/248985 | SEMICONDUCTOR DEVICE | JP2025/014159 | H01L 25/07 | FUJI ELECTRIC CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249149 | MOUNTING TABLE AND PLASMA TREATMENT APPARATUS | JP2025/017411 | H01L 21/683 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249155 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | JP2025/017455 | H01L 21/304 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249178 | SUBSTRATE PROCESSING METHOD | JP2025/017636 | H01L 21/306 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249199 | TEST SYSTEM AND METHOD FOR ASSEMBLING TEST SYSTEM | JP2025/017749 | H01L 21/66 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249209 | COOLING DEVICE | JP2025/017844 | H01L 23/473 | UNITED PRECISION TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249219 | COMPUTER PROGRAM, INFORMATION PROCESSING METHOD, SUBSTRATE PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND SUBSTRATE PROCESSING DEVICE | JP2025/017954 | H01L 21/306 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249225 | COMPUTER PROGRAM, METHOD FOR GENERATING TRAINED MODEL, INFORMATION PROCESSING METHOD, AND INFORMATION PROCESSING DEVICE | JP2025/017981 | H01L 21/02 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249236 | RING-SHAPED MEMBER AND SEMICONDUCTOR MANUFACTURING DEVICE | JP2025/018051 | H01L 21/683 | KYOCERA CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249252 | SUBSTRATE FOR SEMICONDUCTOR PACKAGE, LOW-TEMPERATURE FIRED GLASS CERAMIC PLATE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR PACKAGE | JP2025/018212 | H01L 23/15 | NIPPON ELECTRIC GLASS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249256 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | JP2025/018295 | H01L 21/302 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249259 | SEMICONDUCTOR DEVICE | JP2025/018325 | H01L 21/60 | ROHM CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249279 | SEMICONDUCTOR DEVICE | JP2025/018484 | H01L 25/07 | DENSO CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249286 | REMOVER COMPOSITION FOR LIGHT IRRADIATION REMOVAL | JP2025/018533 | H01L 23/12 | NISSAN CHEMICAL CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249287 | ELECTROSTATIC CHUCK AND ELECTROSTATIC CHUCK DEVICE | JP2025/018555 | H01L 21/683 | KYOCERA CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249296 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE | JP2025/018613 | H01L 21/3065 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249309 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING LAMINATE | JP2025/018690 | H01L 21/60 | TORAY INDUSTRIES, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249353 | OPTICAL DEVICE MANUFACTURING METHOD | JP2025/018871 | H01L 21/66 | NTT INNOVATIVE DEVICES CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249424 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | JP2025/019091 | H01L 21/60 | RESONAC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249455 | WIRING BOARD, PACKAGE FOR HOUSING ELECTRONIC COMPONENT, AND ELECTRONIC MODULE | JP2025/019209 | H01L 23/12 | KYOCERA CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249566 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE | JP2025/019715 | H01L 25/07 | RESONAC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249631 | METHOD FOR AUTOMATICALLY INSPECTING, CLASSIFYING AND REMOVING WAFER DEFECT | KR2024/009667 | H01L 21/66 | COWINDST CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249650 | HUMIDITY CONTROL EQUIPMENT USING TREATMENT FAN THAT PERFORMS DEHUMIDIFICATION AND REGENERATION | KR2024/014983 | H01L 21/67 | YEST CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249686 | METHOD FOR AUTOMATICALLY INSPECTING, CLASSIFYING, AND REMOVING DEFECT OF FLAT SUBSTRATE | KR2024/096118 | H01L 21/66 | COWINDST CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/249813 | SEMICONDUCTOR CHIP PACKAGE HAVING LOW-MELTING-POINT SOLDER-HIGH-MELTING-POINT SOLDER-LOW-MELTING-POINT SOLDER BONDING STRUCTURE, AND MANUFACTURING METHOD THEREFOR | KR2025/006708 | H01L 23/00 | RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250007 | ADDITIVE MANUFACTURING OF FAN-OUT PACKAGES | NL2025/050248 | H01L 23/498 | NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250201 | IN SITU WAFER BOND PROPAGATION MEASUREMENT | US2025/016295 | H01L 21/67 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250227 | METHODS FOR CONTROLLING THE PITCH OF SELF-ASSEMBLED IONIC LIQUID CRYSTAL (ILC) STRUCTURES | US2025/019565 | H01L 21/02 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250228 | METHODS FOR CONTROLLING THE PHASE OF SELF-ASSEMBLED IONIC LIQUID CRYSTAL (ILC) STRUCTURES | US2025/019594 | H01L 21/02 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250254 | ELECTROPLATING WAFER SEAL APEX CLEANING TOOL | US2025/024015 | H01L 21/67 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250315 | ULTRA-FAST TEMPERATURE SWITCHING PEDESTAL | US2025/027593 | H01L 21/687 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250336 | DEVICE COMPRISING AN OPTO-ELECTRONIC INTEGRATED DEVICE AND STACKED INTEGRATED DEVICES | US2025/028635 | H01L 25/16 | QUALCOMM INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250348 | METHODS AND APPARATUS FOR COOLING DIE STACKS | US2025/029140 | H01L 23/46 | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250349 | PAD-LESS HYBRID BONDING | US2025/029141 | H01L 23/00 | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250354 | SELECTIVE METAL ETCHING BY MICROWAVE OXIDATION | US2025/029242 | H01L 21/768 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250363 | PACKAGE COMPRISING AN INTEGRATED DEVICE, A SUBSTRATE AND A HEAT SINK | US2025/029370 | H01L 23/433 | QUALCOMM INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250433 | TOPSIDE COOLING BAND FOR MULTIPLE ELECTRONIC COMPONENTS | US2025/030546 | H01L 23/373 | TEXAS INSTRUMENTS INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250434 | SEMICONDUCTOR DEVICE PACKAGE WITH STUB LEADS AND METHODS | US2025/030566 | H01L 25/00 | TEXAS INSTRUMENTS INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250472 | PASSIVATION FOR SELECTIVE ETCHING SEMICONDUCTOR MATERIALS | US2025/030834 | H01L 21/3065 | LAM RESEARCH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250480 | METHODS AND SYSTEMS FOR CHUCKING HIGHLY BOWED SEMICONDUCTOR WAFERS | US2025/030925 | H01L 21/66 | KLA CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250490 | SYSTEM AND METHOD FOR MONITORING SUPERCRITICAL CO₂ DRYING | US2025/030943 | H01L 21/67 | KLA CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250492 | METHODS FOR GAP FILLING VERTICAL AND LATERAL FEATURES WITH PLASMA INHIBITION | US2025/030945 | H01L 21/02 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250540 | LITHOGRAPHY USING SPIN ISOLATED MONOCHROMATIC ELECTROMAGNETIC RADIATION | US2025/031039 | H01L 21/02 | VIGEN, Eric Arno | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250651 | UTILIZING INFRARED DATA FOR CONTROL OF FABRICATION PROCESSES | US2025/031213 | H01L 21/67 | LAM RESEARCH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250711 | METHODS AND SYSTEMS FOR MEASUREMENT OF SEMICONDUCTOR STRUCTURES WITH MECHANICAL STRESS MODULATION | US2025/031289 | H01L 21/66 | KLA CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250714 | MICROELECTRONIC DEVICE PACKAGE WITH HYBRID ISOLATION LAMINATE | US2025/031296 | H01L 21/48 | TEXAS INSTRUMENTS INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250727 | ELECTRONIC DEVICE WITH INTERIOR AND PERIPHERAL LEADS | US2025/031323 | H01L 23/498 | TEXAS INSTRUMENTS INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250775 | SELECTIVE PASSIVATION OF SILICON NITRIDE USING PASSIVATION MOLECULE HAVING HYDROXYL FUNCTIONAL GROUPS | US2025/031397 | H01L 21/32 | VERSUM MATERIALS US, LLC | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250817 | METHODS AND SYSTEMS FOR THE DEPOSITION OF N-POLAR III-NITRIDES ON SILICON SUBSTRATES | US2025/031464 | H01L 21/02 | MONDE WIRELESS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250904 | TREATMENTS FOR IMPROVING FRACTURE STRENGTH FOR SEMICONDUCTOR WORKPIECE | US2025/031597 | H01L 21/02 | WOLFSPEED, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/250959 | ELASTOMER BOND METHOD FOR ELECTROSTATIC CHUCK ASSEMBLIES WITH THERMALLY ACTIVATED FILLERS FOR ADJUSTABLE LOW TEMPERATURE DEBONDING PROCESS | US2025/031685 | H01L 21/687 | WATLOW ELECTRIC MANUFACTURING COMPANY | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/251049 | INTERPOSER DEVICES WITH MULTIPLE INTERPOSER CORES | US2025/031810 | H01L 23/00 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 49 | WO/2025/251054 | SCALABLE THREE-DIMENSIONAL PROCESSING ARCHITECTURE AND PACKAGE | US2025/031820 | H01L 25/07 | ERIDU CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای |