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سالهفتهIDTitleApplNoIPCApplicantSubgroupزیر گروهرشته شرحDescription
202549WO/2025/217567ELECTRICAL AND OPTICAL INTERCONNECT LINKS COMBINED IN A HYBRID INTERPOSERUS2025/024346H01L 25/16ACORN SEMI, LLCELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/230785COOLING SYSTEM FOR POWER ELECTRONICSUS2025/025920H01L 23/427CARRIER CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/245724DRIVING BACKPLANE AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL, AND DISPLAY DEVICECN2024/095977H01L 27/12SOUTHERN UNIVERSITY OF SCIENCE & TECHNOLOGYELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/245861FULL-COLOR NANO-LED ARRAYCN2024/096754H01L 33/38INSTITUTE OF SEMICONDUCTORS, CHINESE ACADEMY OF SCIENCESELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/246069TEMPERATURE EQUALIZING HEAT DISSIPATION APPARATUS AND MANUFACTURING METHOD AND DESIGN METHOD THEREFOR, STORAGE MEDIUM, AND ELECTRONIC DEVICECN2024/116788H01L 23/367CRRC ZHUZHOU ELECTRIC LOCOMOTIVE RESEARCH INSTITUTE CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/246150PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE, AND ELECTRONIC DEVICECN2024/126273H01L 23/498CXMT CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/246154SEMICONDUCTOR PROCESSING DEVICECN2024/126962H01L 21/67JIANGSU LEUVEN INSTRUMENTS CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/246303CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICECN2024/140412H01L 23/31HUAWEI TECHNOLOGIES CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/246643BACKLIGHT LAMP PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUSCN2025/087172H01L 25/075BOE TECHNOLOGY GROUP CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/246683ELECTRONIC COMPONENT TRANSFER DEVICECN2025/088334H01L 21/00BOE TECHNOLOGY GROUP CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/246688DISPLAY PANEL AND DISPLAY DEVICECN2025/088734H01L 23/552WUHAN TIANMA MICROELECTRONICS CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/246756PACKAGING STRUCTURE CLEANING METHOD AND APPARATUSCN2025/091421H01L 21/67ACM RESEARCH (SHANGHAI) , INC.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/246758CLEANING METHOD AND CLEANING DEVICE FOR PACKAGED STRUCTURECN2025/091435H01L 21/67ACM RESEARCH (SHANGHAI) , INC.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/246759PRE-WETTING METHOD AND DEVICE FOR WAFERCN2025/091445H01L 21/768ACM RESEARCH (SHANGHAI) , INC.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/247014POWER MODULE AND SEMICONDUCTOR DEVICECN2025/095962H01L 23/498BYD COMPANY LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/247047MOS DEVICE AND OVERHEATING PREVENTION METHOD THEREFOR, CONTROLLER, CONTROL SYSTEM, AND VEHICLECN2025/096319H01L 23/367BYD COMPANY LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/247095METHOD FOR FORMING TRENCH, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND PROCESS APPARATUSCN2025/096773H01L 21/768BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/247497POWER MODULE HAVING IMPROVED SWITCHING PERFORMANCE AND METHOD FOR IMPROVING SWITCHING PERFORMANCE OF A POWER MODULEEP2024/065008H01L 25/07HITACHI ENERGY LTDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/247507APPARATUS FOR TRANSFERRING A SEMICONDUCTOR DIE FROM AN ARRANGEMENT OF SEMICONDUCTOR DIES TO A TARGETEP2024/065112H01L 21/67NEXPERIA B.V.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/247508DIE BONDING APPARATUS AND METHOD UTILIZING SUCH APPARATUSEP2024/065114H01L 23/00NEXPERIA B.V.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/247645POWER SEMICONDUCTOR ARRANGEMENT COMPRISING A POWER SEMICONDUCTOR ELEMENT AND A SUBSTRATEEP2025/063252H01L 23/367SIEMENS AKTIENGESELLSCHAFTELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/247764SINGLE-SWITCH POWER MODULEEP2025/064253H01L 23/495ROBERT BOSCH GMBHELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/247863OPTIMISED POWER UTILISATION OF SEMICONDUCTOR DEVICES IN POWER MODULES AND POWER MODULE BRIDGESEP2025/064574H01L 25/07ROBERT BOSCH GMBHELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248202PRODUCTION OF A POWER MODULEFR2025/050469H01L 23/15SAFRAN ELECTRICAL & POWERELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248355MULTICHIP SEMICONDUCTOR BUILD WITH FLEXIBLE POWER AND SIGNAL DISTRIBUTION INTERCONNECTIONSIB2025/054769H01L 23/48INTERNATIONAL BUSINESS MACHINES CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248513COATING DIELECTRIC SURFACES WITH PATTERNED METAL LAYERIL2025/050396H01L 21/302ISRAEL AEROSPACE INDUSTRIES LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248572SUBSTRATE STORAGE CONTAINERJP2024/019322H01L 21/673MIRAIAL CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248576DEFECT INSPECTION DEVICE, AND DEFECT INSPECTION METHODJP2024/019333H01L 21/66HITACHI HIGH-TECH CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248586SUBSTRATE PROCESSING DEVICE, SUBSTRATE PEELING METHOD, PEELING DEVICE, AND PEELING METHODJP2024/019393H01L 21/683MITSUBISHI ELECTRIC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248600METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND PRINTED WIRING BOARDJP2024/019430H01L 23/12RESONAC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248678GaN EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SAMEJP2024/019759H01L 21/205MITSUBISHI ELECTRIC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248691QUANTUM DEVICEJP2024/019826H01L 29/06HITACHI, LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248692QUANTUM DEVICE AND QUANTUM INFORMATION PROCESSING DEVICEJP2024/019827H01L 29/06HITACHI, LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248712SWITCHING ELEMENTJP2024/019879H01L 29/78DENSO CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248744EMBEDDING METHOD AND FILM FORMING DEVICEJP2024/019986H01L 21/3065TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248754QUANTUM BIT CONTROL DEVICE, QUANTUM COMPUTER SYSTEM, AND QUANTUM BIT CONTROL METHODJP2024/020024H01L 29/06HITACHI, LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248784METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGEJP2024/020106H01L 33/52RESONAC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248816MEASURING DEVICE, RESIN MOLDING DEVICE, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLEJP2024/042295H01L 23/28TOWA CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248832CERAMIC SUSCEPTORJP2024/046448H01L 21/683NGK INSULATORS, LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248844MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUSJP2025/001940H01L 21/683NGK INSULATORS, LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248846INSULATING CIRCUIT BOARD, METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING SAMEJP2025/002074H01L 23/12DOWA METALTECH CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248907HYBRID JOINING METHODJP2025/009229H01L 21/02JX ADVANCED METALS CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248914MOUNTING DEVICEJP2025/010078H01L 21/60PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248923SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSJP2025/010639H01L 21/304SCREEN HOLDINGS CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248934CARRIER SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEJP2025/011524H01L 23/12MITSUBISHI MATERIALS CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248937HEAT EXCHANGE SUBSTRATE AND SEMICONDUCTOR DEVICEJP2025/011959H01L 23/36DENSO CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248954PACKAGE AND METHOD FOR MANUFACTURING PACKAGEJP2025/013519H01L 23/02SONY SEMICONDUCTOR SOLUTIONS CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248960SIC COMPOSITE SUBSTRATE AND MANUFACTURING METHOD THEREFORJP2025/013745H01L 21/20ROHM CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248962SUBSTRATE PROCESSING DEVICEJP2025/013771H01L 21/027SCREEN HOLDINGS CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248965MEMBER FOR SEMICONDUCTOR MANUFACTURING DEVICEJP2025/013824H01L 21/683NGK INSULATORS, LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248983SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEJP2025/014152H01L 25/04AOI ELECTRONICS CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/248985SEMICONDUCTOR DEVICEJP2025/014159H01L 25/07FUJI ELECTRIC CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249149MOUNTING TABLE AND PLASMA TREATMENT APPARATUSJP2025/017411H01L 21/683TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249155SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHODJP2025/017455H01L 21/304TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249178SUBSTRATE PROCESSING METHODJP2025/017636H01L 21/306TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249199TEST SYSTEM AND METHOD FOR ASSEMBLING TEST SYSTEMJP2025/017749H01L 21/66TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249209COOLING DEVICEJP2025/017844H01L 23/473UNITED PRECISION TECHNOLOGIES CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249219COMPUTER PROGRAM, INFORMATION PROCESSING METHOD, SUBSTRATE PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND SUBSTRATE PROCESSING DEVICEJP2025/017954H01L 21/306TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249225COMPUTER PROGRAM, METHOD FOR GENERATING TRAINED MODEL, INFORMATION PROCESSING METHOD, AND INFORMATION PROCESSING DEVICEJP2025/017981H01L 21/02TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249236RING-SHAPED MEMBER AND SEMICONDUCTOR MANUFACTURING DEVICEJP2025/018051H01L 21/683KYOCERA CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249252SUBSTRATE FOR SEMICONDUCTOR PACKAGE, LOW-TEMPERATURE FIRED GLASS CERAMIC PLATE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR PACKAGEJP2025/018212H01L 23/15NIPPON ELECTRIC GLASS CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249256SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODJP2025/018295H01L 21/302TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249259SEMICONDUCTOR DEVICEJP2025/018325H01L 21/60ROHM CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249279SEMICONDUCTOR DEVICEJP2025/018484H01L 25/07DENSO CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249286REMOVER COMPOSITION FOR LIGHT IRRADIATION REMOVALJP2025/018533H01L 23/12NISSAN CHEMICAL CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249287ELECTROSTATIC CHUCK AND ELECTROSTATIC CHUCK DEVICEJP2025/018555H01L 21/683KYOCERA CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249296SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICEJP2025/018613H01L 21/3065TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249309RESIN COMPOSITION, CURED PRODUCT, LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING LAMINATEJP2025/018690H01L 21/60TORAY INDUSTRIES, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249353OPTICAL DEVICE MANUFACTURING METHODJP2025/018871H01L 21/66NTT INNOVATIVE DEVICES CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249424METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGEJP2025/019091H01L 21/60RESONAC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249455WIRING BOARD, PACKAGE FOR HOUSING ELECTRONIC COMPONENT, AND ELECTRONIC MODULEJP2025/019209H01L 23/12KYOCERA CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249566METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGEJP2025/019715H01L 25/07RESONAC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249631METHOD FOR AUTOMATICALLY INSPECTING, CLASSIFYING AND REMOVING WAFER DEFECTKR2024/009667H01L 21/66COWINDST CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249650HUMIDITY CONTROL EQUIPMENT USING TREATMENT FAN THAT PERFORMS DEHUMIDIFICATION AND REGENERATIONKR2024/014983H01L 21/67YEST CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249686METHOD FOR AUTOMATICALLY INSPECTING, CLASSIFYING, AND REMOVING DEFECT OF FLAT SUBSTRATEKR2024/096118H01L 21/66COWINDST CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/249813SEMICONDUCTOR CHIP PACKAGE HAVING LOW-MELTING-POINT SOLDER-HIGH-MELTING-POINT SOLDER-LOW-MELTING-POINT SOLDER BONDING STRUCTURE, AND MANUFACTURING METHOD THEREFORKR2025/006708H01L 23/00RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITYELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250007ADDITIVE MANUFACTURING OF FAN-OUT PACKAGESNL2025/050248H01L 23/498NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNOELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250201IN SITU WAFER BOND PROPAGATION MEASUREMENTUS2025/016295H01L 21/67TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250227METHODS FOR CONTROLLING THE PITCH OF SELF-ASSEMBLED IONIC LIQUID CRYSTAL (ILC) STRUCTURESUS2025/019565H01L 21/02TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250228METHODS FOR CONTROLLING THE PHASE OF SELF-ASSEMBLED IONIC LIQUID CRYSTAL (ILC) STRUCTURESUS2025/019594H01L 21/02TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250254ELECTROPLATING WAFER SEAL APEX CLEANING TOOLUS2025/024015H01L 21/67APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250315ULTRA-FAST TEMPERATURE SWITCHING PEDESTALUS2025/027593H01L 21/687APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250336DEVICE COMPRISING AN OPTO-ELECTRONIC INTEGRATED DEVICE AND STACKED INTEGRATED DEVICESUS2025/028635H01L 25/16QUALCOMM INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250348METHODS AND APPARATUS FOR COOLING DIE STACKSUS2025/029140H01L 23/46ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250349PAD-LESS HYBRID BONDINGUS2025/029141H01L 23/00ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250354SELECTIVE METAL ETCHING BY MICROWAVE OXIDATIONUS2025/029242H01L 21/768APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250363PACKAGE COMPRISING AN INTEGRATED DEVICE, A SUBSTRATE AND A HEAT SINKUS2025/029370H01L 23/433QUALCOMM INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250433TOPSIDE COOLING BAND FOR MULTIPLE ELECTRONIC COMPONENTSUS2025/030546H01L 23/373TEXAS INSTRUMENTS INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250434SEMICONDUCTOR DEVICE PACKAGE WITH STUB LEADS AND METHODSUS2025/030566H01L 25/00TEXAS INSTRUMENTS INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250472PASSIVATION FOR SELECTIVE ETCHING SEMICONDUCTOR MATERIALSUS2025/030834H01L 21/3065LAM RESEARCH CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250480METHODS AND SYSTEMS FOR CHUCKING HIGHLY BOWED SEMICONDUCTOR WAFERSUS2025/030925H01L 21/66KLA CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250490SYSTEM AND METHOD FOR MONITORING SUPERCRITICAL CO₂ DRYINGUS2025/030943H01L 21/67KLA CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250492METHODS FOR GAP FILLING VERTICAL AND LATERAL FEATURES WITH PLASMA INHIBITIONUS2025/030945H01L 21/02APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250540LITHOGRAPHY USING SPIN ISOLATED MONOCHROMATIC ELECTROMAGNETIC RADIATIONUS2025/031039H01L 21/02VIGEN, Eric ArnoELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250651UTILIZING INFRARED DATA FOR CONTROL OF FABRICATION PROCESSESUS2025/031213H01L 21/67LAM RESEARCH CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250711METHODS AND SYSTEMS FOR MEASUREMENT OF SEMICONDUCTOR STRUCTURES WITH MECHANICAL STRESS MODULATIONUS2025/031289H01L 21/66KLA CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250714MICROELECTRONIC DEVICE PACKAGE WITH HYBRID ISOLATION LAMINATEUS2025/031296H01L 21/48TEXAS INSTRUMENTS INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250727ELECTRONIC DEVICE WITH INTERIOR AND PERIPHERAL LEADSUS2025/031323H01L 23/498TEXAS INSTRUMENTS INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250775SELECTIVE PASSIVATION OF SILICON NITRIDE USING PASSIVATION MOLECULE HAVING HYDROXYL FUNCTIONAL GROUPSUS2025/031397H01L 21/32VERSUM MATERIALS US, LLCELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250817METHODS AND SYSTEMS FOR THE DEPOSITION OF N-POLAR III-NITRIDES ON SILICON SUBSTRATESUS2025/031464H01L 21/02MONDE WIRELESS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202549WO/2025/250904TREATMENTS FOR IMPROVING FRACTURE STRENGTH FOR SEMICONDUCTOR WORKPIECEUS2025/031597H01L 21/02WOLFSPEED, INC.ELECTRICITYالکتریسیتهدانش هسته ای
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202549WO/2025/251049INTERPOSER DEVICES WITH MULTIPLE INTERPOSER CORESUS2025/031810H01L 23/00APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
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